

Computers are now becoming more power conscious, thinner, lighter and smaller in size, and feature rich in terms of I/O inter-connectivity. I/Os such as Type-C (10Gbps), eSATA (6 G), DisplayPort (8.1 Gbps), HDMI (6 Gbps), USB 3.1 (10 Gbps), and PCIe (8 Gbps) are found all over the PC. Winbond provides routing and signal integrity enhancing solutions for all of these I/O standards. Within the peripheral market such as monitors and printers, the same signals can be found and thus demanding similar solutions.
Winbond offers a number of products for the emerging USB Type-C® connector standard for ultra-mobile notebook / all-in-one PCs, tablet, and smartphones. They include high performance crossbar switches, Mux Switches, c switch and ic switch, USB 3.1 Gen2/ Gen1 and Display Port 1.4/ 1.2 ReDrivers/ Repeaters, and USB power delivery or USB Type-C power delivery (USB PD or USB C PD) solutions; such as charger controller, charger detection, intelligent power switches, AC-DC and DC-DC converter solutions, transient voltage protection voltage protection and discrete MOSFETs.
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Computer systems that create safer and efficient environments for Computer market.
- IC DRAM 256MBIT PARALLEL 90VFBGA
- IC FLSH 2GBIT SPI 104MHZ 24TFBGA
- 128MB HYPERRAM X8, 166MHZ, IND T
- IC FLASH 2MBIT SPI 104MHZ 8SOIC
- IC FLASH 16MBIT SPI/QUAD 8USON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 2GBIT SPI 16SOP
- IC DRAM 1GBIT PARALLEL 84WBGA
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- IC FLASH 32MBIT SPI/QUAD 8WSON
- IC DRAM 2GBIT PARALLEL 78VFBGA
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
