

The fast growing embedded market is one of the most diverse in terms of end applications. Embedded includes traditional general purpose ‘embedded CPU’ platforms such as Medical, Robotics, Industrial Control, and Data Acquisition, but can also include Video Surveillance, Automotive, Point-of-Sale, and other more specialized applications. Winbond offers a wide variety of support products for all of these sub segment platforms, ranging from specialized Timing products like processor specific XO and clocks, to Bridge that can connect the latest PCIe based embedded processor families to legacy protocols such as PCI-X, PCI, USB, UART, and more. In fact, Winbond Timing, Switching, and Signal Conditioning products are already used in most embedded platform applications with the most popular embedded processors.
Embedded processors can include CPU chipsets from major CPU vendors, SOC, and FPGA from major vendors which are used across all embedded segments. As an example, the FPGA-Winbond block diagram illustrates the many I/O, power management, and timing functions that Winbond can provide.
Medical Device
Winbond offers the medical device industry’s best combination of bundled solutions optimized for performance and bill-of-materials (BOM) cost.
Multi-Function Printer
Multi-function Peripheral (MFP) applications have been, and continue to be, a primary market segment focus for Winbond.
Smart Grid
Winbond provides a comprehensive range of IC and FCP products for Smart Grid applications.
Security
Winbond delivers a broad range of Video Decoder, PCI Bridge and Packet Switches, Video Switches and Repeaters.
Point of Sale
Point of Sale (POS) applications have been, and continue to be, a primary market segment focus for Winbond.
Winbond Distributor's system expertise and large selection of reference designs allow engineers to design smarter, more robust Embedded Systems systems that create safer and efficient environments for Embedded Systems market.
- IC DRAM 128MBIT PAR 54TSOP II
- IC DRAM 256MBIT PAR 54TSOP II
- IC FLSH 128MBIT SPI/QUAD 24TFBGA
- IC FLASH 16MBIT SPI 75MHZ 16SOIC
- IC FLASH 64MBIT SPI/QUAD 8XSON
- IC DRAM 2GBIT PARALLEL 78VFBGA
- IC FLASH 4MBIT SPI 104MHZ 8SOIC
- IC FLASH 32MBIT SPI/QUAD 24TFBGA
- IC DRAM 128MBIT PARALLEL 90VFBGA
- IC FLASH 2GBIT PARALLEL 63VFBGA
- SPIFLASH, 3V, 16M-BIT, 4KB UNIFO
- IC FLASH 64MBIT SPI/QUAD 24TFBGA
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
- Winbond announced the introduction of new HyperRAM™ products with WLCSP
- Winbond has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market
