Winbond Authentication Flash

Security weaknesses in companion Flash memory to an MCU or SoC expose OEMs to the risk of product theft due to the cloning of reverse engineered PCB designs.

Authentication flash memory provides a secure handshake between the controller and the memory to ensure enhanced security of the data transmitted between two devices. These products in the W74M family come with standard HMAC-SHA-256 crypto accelerator and 4 separate Monotonic Flash Counters that are HMAC-signed (Hash-based Message Authentication Code) by individual secret keys.

Systems utilizing each Monotonic Flash Counter can not only verify the integrity and authenticity of the counter values, but also add a timestamp to the message/information transmitted as well as provide resistance to repeated attacks.

W74M products enable system designers to strengthen code/data storage as well as deliver increased security with multi-layered authenticity for emerging IoT devices on the edge and outside the cloud. These security products also provide enhanced security to gateways, sensors, doorbells, cameras and other similar devices in automotive, industrial, communication, and consumer applications.

Winbond Code Storage Flash Memory

The Code Storage Flash Memory family consists of NOR, NAND and TrustME® Secure Flash Memories. Winbond is the #1 supplier of Serial Flash products in the industry and is the largest unit supplier of NOR flash memories. In this SpiFlash® family, products range in densities from 512Kb through 1Gb mostly in small 8-pin packages, in addition to 16-pin SOIC and 24-ball BGA packages at 3V and 1.8V with speeds up to 133MHz.

The SLC NAND flash memories are offered in densities from 1Gb through 4Gb in JEDEC standard packages and are compliant to the ONFi standard. As an extension to the SpiNOR family, Winbond offers QspiNAND flash products in 1Gb and 2Gb densities with special features like continuous read which facilitates fast data transfer between flash and DRAM on system designs. The QspiNAND products have built-in ECC and bad block management which simplifies the management of NAND. All of these flash products are available as KGD (Known Good Die) as well. A family of Multi Chip Package (MCP) NAND + DRAM products are also offered ranging from 1Gb through 4Gb densities at 1.8V primarily used in mobile and other applications.

With AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 qualifications, flash memory products are available in Industrial grade and several of these products are qualified for Automotive grade. These products in the flash memory family are used in computer, communication, consumer, mobile, automotive and industrial applications.

Do you know more about Winbond's product uses, technical documents, and solutions related to Authentication Flash? Then quickly get in touch with Winbond Distributor - NHE!