

Winbond DDR3 SDRAM
Winbond DDR3 SDRAM ( double-data-rate synchronous dynamic random access memory generation 3 ) is a type of memory used in electronics. Such as Automotive, industrial, TV, STB, Network, BD-Player and so on.
It achieves greater bandwidth than the preceding DDR2 SDRAM by higher clock rate.
Winbond Specialty DRAM
Winbond’s DRAM product portfolio is consisting of Mobile RAM and Specialty DRAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. Completed solution can be provided to variety customers. SDR, DDR, DDR2, and DDR3 support for Industrial and automotive application with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test…etc.
Do you know more about Winbond's product uses, technical documents, and solutions related to DDR3 SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- IC FLASH
- IC DRAM 1GBIT PARALLEL 96VFBGA
- IC FLASH 8MBIT SPI 80MHZ 8WLCSP
- IC SDRAM 1GB DDR3 800MHZ 96WBGA
- IC FLASH 32MBIT PARALLEL 48TFBGA
- IC FLASH 64MBIT SPI/QUAD 8WSON
- IC FLASH 1GBIT SPI 104MHZ 8WSON
- IC DRAM 2GBIT PARALLEL 78WBGA
- IC FLASH
- IC FLASH 4MBIT SPI 75MHZ 8WSON
- IC FLASH 64MBIT SPI 104MHZ 8WSON
- IC DRAM 2GBIT PARALLEL 96VFBGA
- Winbond announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFla
- Winbond announced it is now the top supplier of all NOR Flash memories worldwide
- Winbond announced the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
