Winbond HyperRAM™

Winbond HyperRAM™ products provide a compact alternative to traditional pseudo-SRAM in IoT and consumer devices, automotive and industrial equipment. The introduction in 2021 of HyperRAM™ devices produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb.

Ultra-low Power Consumption:

Winbond’s Hybrid Sleep Mode (HSM) gives standby power consumption as low as 45μW, and operating power less than half that of equivalent pSRAM products.

Design Simplicity:

HyperRAM™ devices use just 13 signal pins, compared to 31 signal pins in pSRAM. This makes the board layout much simpler to design and manufacture.

Space-saving:

Low pin-count packages and a lower number of connections to the host controller reduce the memory system’s board footprint and save space in consumer devices such as smart watches.

Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication. Winbond mobile DRAM devices support both x16 and x32 data widths. Major features for the families of products shown in the table below include the following: Sequential or Interleave burst、High Clock rate、Standard Self Refresh、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh Rate(ATCSR)、Deep Power-Down (DPD)、and Programmable output buffer driver strength. They are ideal for portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.

Do you know more about Winbond's product uses, technical documents, and solutions related to HyperRAM™? Then quickly get in touch with Winbond Distributor - NHE!