

Winbond Low Power SDR SDRAM
Winbond’s LPSDR SDRAM(Low Power SDR SDRAM) product family is designed with specific features to reduce power consumption, including Partial Array Self Refresh (PASR), Auto Temperature Compensated Self Refresh (ATCSR), Power down mode, Deep power down mode and Programmable output buffer driving strength.
Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication. Winbond mobile DRAM devices support both x16 and x32 data widths. Major features for the families of products shown in the table below include the following: Sequential or Interleave burst、High Clock rate、Standard Self Refresh、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh Rate(ATCSR)、Deep Power-Down (DPD)、and Programmable output buffer driver strength. They are ideal for portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.
Do you know more about Winbond's product uses, technical documents, and solutions related to Low Power SDR SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- IC DRAM 2GBIT PARALLEL 78VFBGA
- IC DRAM 128MBIT PARALLEL 54VFBGA
- IC FLSH 64MBIT SPI 104MHZ 16SOIC
- IC SDRAM 1GB X8 1066MHZ 78WBGA
- IC FLASH 128MBIT SPI/QUAD 8SOIC
- IC FLASH 8MBIT SPI 80MHZ 8SOIC
- IC FLASH 16MBIT SPI/QUAD 8SOIC
- IC DRAM 256MBIT PARALLEL 54VFBGA
- 1G-BIT SERIAL NAND FLASH, 1.8V
- IC FLSH 256MBIT SPI/QUAD 24TFBGA
- IC DRAM 1GBIT PARALLEL 96WBGA
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
