Winbond NAND Based MCP

Winbond’s Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on PCBs (Printed Circuit Boards).

One of the benefits of NAND flash is its non-volatile storage of data, NAND memory retains data even when the power is off. This benefit becomes more critical in small PCBs for modules and space critical designs particularly in mobile and portable applications.

Own DRAM and SLC NAND Flash Technology

Winbond Electronics Corp. is a Memory IC Company engaged in DRAM & Flash design, manufacturing and sales services. From product design, research and development, wafer fabrication to marketing of brand name products, Winbond endeavors to provide its global clientele top quality of low to medium density memory solutions.

Own 12-inch Fab

Winbond specializes in the design of high-performance, low-power memory, and riding on the strength of having a 12-inch fab, offers a whole series of SLC code storage NAND flash memory and Mobile DRAM products. Our in house wafer fabrication provides customers with full commitment in capacity support as well as delivery flexibility.

Longevity Support

Winbond Electronics Corporation, a longtime provider of memory semiconductors, is now offering a Winbond Product Longevity Program (WPLP) for applications that require long-term support which offers stability and longevity for long-life applications that need support for 5+ to 10 years.

Winbond Code Storage Flash Memory

The Code Storage Flash Memory family consists of NOR, NAND and TrustME® Secure Flash Memories. Winbond is the #1 supplier of Serial Flash products in the industry and is the largest unit supplier of NOR flash memories. In this SpiFlash® family, products range in densities from 512Kb through 1Gb mostly in small 8-pin packages, in addition to 16-pin SOIC and 24-ball BGA packages at 3V and 1.8V with speeds up to 133MHz.

The SLC NAND flash memories are offered in densities from 1Gb through 4Gb in JEDEC standard packages and are compliant to the ONFi standard. As an extension to the SpiNOR family, Winbond offers QspiNAND flash products in 1Gb and 2Gb densities with special features like continuous read which facilitates fast data transfer between flash and DRAM on system designs. The QspiNAND products have built-in ECC and bad block management which simplifies the management of NAND. All of these flash products are available as KGD (Known Good Die) as well. A family of Multi Chip Package (MCP) NAND + DRAM products are also offered ranging from 1Gb through 4Gb densities at 1.8V primarily used in mobile and other applications.

With AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 qualifications, flash memory products are available in Industrial grade and several of these products are qualified for Automotive grade. These products in the flash memory family are used in computer, communication, consumer, mobile, automotive and industrial applications.

Do you know more about Winbond's product uses, technical documents, and solutions related to NAND Based MCP? Then quickly get in touch with Winbond Distributor - NHE!