Winbond OctalNAND Flash

The world’s first x8 Octal interface for NAND flash memory, Winbond’s OctalNAND flash enables automotive and industrial manufacturers to provide code storage in high density without having to pay a premium for NOR flash, a fast memory technology which scales poorly at densities above 512Mbits.

The first Winbond product to include the new interface, the 1Gbit W35N01JW, offers a maximum continuous Read throughput of 240MB/s, three times faster than the earlier high-performance W25N-JW QspiNAND Flash family.

The OctalNAND flash offers partial compatibility with Octal NOR flash, which makes it easier to replace NOR flash in existing designs.

Manufactured in Winbond’s proven 46nm Single Level Cell (SLC) NAND fabrication process, the W35N-JW OctalNAND flash offers excellent data integrity and more than ten years’ data retention. It is specified to perform more than 100,000 Program/Erase cycles, providing the high level of endurance and reliability required in mission-critical automotive and industrial applications, including graphics displays and advanced driver-assistance systems (ADAS) in which the boot code size is often higher than 512 Mbits, NOR flash is reaching its limitations in scale.

Winbond Code Storage Flash Memory

The Code Storage Flash Memory family consists of NOR, NAND and TrustME® Secure Flash Memories. Winbond is the #1 supplier of Serial Flash products in the industry and is the largest unit supplier of NOR flash memories. In this SpiFlash® family, products range in densities from 512Kb through 1Gb mostly in small 8-pin packages, in addition to 16-pin SOIC and 24-ball BGA packages at 3V and 1.8V with speeds up to 133MHz.

The SLC NAND flash memories are offered in densities from 1Gb through 4Gb in JEDEC standard packages and are compliant to the ONFi standard. As an extension to the SpiNOR family, Winbond offers QspiNAND flash products in 1Gb and 2Gb densities with special features like continuous read which facilitates fast data transfer between flash and DRAM on system designs. The QspiNAND products have built-in ECC and bad block management which simplifies the management of NAND. All of these flash products are available as KGD (Known Good Die) as well. A family of Multi Chip Package (MCP) NAND + DRAM products are also offered ranging from 1Gb through 4Gb densities at 1.8V primarily used in mobile and other applications.

With AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 qualifications, flash memory products are available in Industrial grade and several of these products are qualified for Automotive grade. These products in the flash memory family are used in computer, communication, consumer, mobile, automotive and industrial applications.

Do you know more about Winbond's product uses, technical documents, and solutions related to OctalNAND Flash? Then quickly get in touch with Winbond Distributor - NHE!