

Winbond SDRAM
Synchronous DRAM is designed to process data at the same clock speed as the CPU. Therefore, synchronous DRAM is regarded as the core component that is used in high speed processing of large volumes of data. Currently, its usage is expanding to various consumer electronics such as Automotive, Industrial, Networking, DTV, DSC and STB.
Winbond Specialty DRAM
Winbond’s DRAM product portfolio is consisting of Mobile RAM and Specialty DRAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. Completed solution can be provided to variety customers. SDR, DDR, DDR2, and DDR3 support for Industrial and automotive application with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test…etc.
Do you know more about Winbond's product uses, technical documents, and solutions related to SDRAM? Then quickly get in touch with Winbond Distributor - NHE!
- IC FLASH 32MBIT 8SOIC
- IC DRAM 128MBIT PAR 66TSOP II
- IC FLASH
- IC DRAM 16MBIT PAR 50TSOP II
- IC FLASH 64MBIT SPI/QUAD 8WSON
- IC FLASH 32MBIT SPI/QUAD 8WSON
- SPIFLASH, 1.8V, 256M-BIT, 4KB UN
- IC FLASH 512MBIT SPI/QUAD 8WSON
- IC FLASH 32MBIT SPI/QUAD 8WSON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 128MBIT SPI/QUAD 8WSON
- IC FLASH 64MBIT SPI 8DIP
- Winbond announced TrustME® W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C
- Winbond announced SpiStack® memory provides unique benefits when implementing Over-the-Air (OTA) up
- Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device
- Winbond announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwid
- Winbond Electronics announced key enhancements to its DDR3 product on the ultra-high-speed performan
- Winbond announced TrustME® W77Q Secure Flash had obtained Security Evaluation Standard
- Winbond announced 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conserv
- Winbond Electronics announced that they had received the ISO/SAE 21434 certification from TÜV NORD
- Winbond Electronics announced that its Flash Memory products will now support the low temperature so
- Winbond TrustME® W77Q wins OFweek China IoT Innovative Product Awards 2022
- Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
- Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium
