Winbond Serial NOR Flash

SpiFlash® Memories with SPI, Dual-SPI, Quad-SPI and QPI

Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512K-bit to 512M-bit, small erasable sectors and the industry's highest performance.

The W25X family supports Dual-SPI, effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/S transfer rate) when using Quad-SPI. This is more than four times the performance of ordinary Serial Flash (50MHz) and even surpasses asynchronous Parallel Flash memories while using fewer pins and less space.

Faster transfer rates mean controllers can execute code with Execute in Place methods (XIP) directly from the SPI interface or further improve boot time when shadowing code to RAM.

Some SpiFlash® devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form factor packages are ideal for space constrained mobile and handheld applications.

Winbond Code Storage Flash Memory

The Code Storage Flash Memory family consists of NOR, NAND and TrustME® Secure Flash Memories. Winbond is the #1 supplier of Serial Flash products in the industry and is the largest unit supplier of NOR flash memories. In this SpiFlash® family, products range in densities from 512Kb through 1Gb mostly in small 8-pin packages, in addition to 16-pin SOIC and 24-ball BGA packages at 3V and 1.8V with speeds up to 133MHz.

The SLC NAND flash memories are offered in densities from 1Gb through 4Gb in JEDEC standard packages and are compliant to the ONFi standard. As an extension to the SpiNOR family, Winbond offers QspiNAND flash products in 1Gb and 2Gb densities with special features like continuous read which facilitates fast data transfer between flash and DRAM on system designs. The QspiNAND products have built-in ECC and bad block management which simplifies the management of NAND. All of these flash products are available as KGD (Known Good Die) as well. A family of Multi Chip Package (MCP) NAND + DRAM products are also offered ranging from 1Gb through 4Gb densities at 1.8V primarily used in mobile and other applications.

With AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 qualifications, flash memory products are available in Industrial grade and several of these products are qualified for Automotive grade. These products in the flash memory family are used in computer, communication, consumer, mobile, automotive and industrial applications.

Do you know more about Winbond's product uses, technical documents, and solutions related to Serial NOR Flash? Then quickly get in touch with Winbond Distributor - NHE!