Winbond SpiStack® Flash

Winbond is the first company to offer the new SpiStack® W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions most appropriate for their design requirements.

SpiStack® architecture offers designers maximum flexibility in tailoring flash solutions to meet their specific memory-density and application requirements.

The W25M Series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. W25M memories also feature the popular, multi-IO SpiFlash® interface featuring the popular Serial Peripheral Interface (SPI) and command set.

SpiStack® homogeneous memories are formed by stacking SpiFlash dies – for example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. This stacked product, W25M512JV, is also available now in 16-pin SOIC or 24-pad BGA packages.

SpiStack® heterogeneous memories are formed by stacking a NOR die with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory.

Why stacked die - SpiStack® Flash Memory

Individual components forming the stacked solution have clock rates up to 104MHz achieving an equivalent of 416MHz (50M-Byte/S transfer rate) when using Quad-SPI. Multiple SpiFlash dies, each with density ranging from 16Mb to 2Gb, can be stacked with any combination of NOR and NAND dies. A NOR die can be used to store the boot code, which offers better endurance and retention, and fast random access time. A NAND memory can be used to store data and to back up the boot code.

A NAND die can also be used to upload the working memory data quickly whenever the system power goes down, since its programming time is much faster than NOR. It improves the system quality by storing up-to-date code residing in the working memory for later usage.

SpiStack® supports concurrent operation so that code execution is not interrupted for data updates. All SpiStack® features are supported so that backward compatibility is conserved with the addition of a simple software die select instruction (C2h) and a factory-assigned die ID number.

Winbond Code Storage Flash Memory

The Code Storage Flash Memory family consists of NOR, NAND and TrustME® Secure Flash Memories. Winbond is the #1 supplier of Serial Flash products in the industry and is the largest unit supplier of NOR flash memories. In this SpiFlash® family, products range in densities from 512Kb through 1Gb mostly in small 8-pin packages, in addition to 16-pin SOIC and 24-ball BGA packages at 3V and 1.8V with speeds up to 133MHz.

The SLC NAND flash memories are offered in densities from 1Gb through 4Gb in JEDEC standard packages and are compliant to the ONFi standard. As an extension to the SpiNOR family, Winbond offers QspiNAND flash products in 1Gb and 2Gb densities with special features like continuous read which facilitates fast data transfer between flash and DRAM on system designs. The QspiNAND products have built-in ECC and bad block management which simplifies the management of NAND. All of these flash products are available as KGD (Known Good Die) as well. A family of Multi Chip Package (MCP) NAND + DRAM products are also offered ranging from 1Gb through 4Gb densities at 1.8V primarily used in mobile and other applications.

With AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 qualifications, flash memory products are available in Industrial grade and several of these products are qualified for Automotive grade. These products in the flash memory family are used in computer, communication, consumer, mobile, automotive and industrial applications.

Do you know more about Winbond's product uses, technical documents, and solutions related to SpiStack® Flash? Then quickly get in touch with Winbond Distributor - NHE!